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Semco E-Chucks
Global
Clamping Solutions
SHRINK YOUR WAFER TEMPERATURE
UNIFORMITY
SEMCO Global clamping solution offers a wide range of coulombic ESC dedicated for the etch processes for both semiconductor and MEMS industries. Capabilities to
clamp Si, GaAs, InP, SiC wafer as well as
Insulating material such as Borosilicate, or SOG wafer. Compatible with
usual etch Fluor or Chlorine chemistry.
Thermal modeling capability  Modeling Results DT = ±0.36°C
Esc @0°C / Heat load on wafer 1W/cm2 / BSG 10 Torr He
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